2007 semiconductor lighting technology and industry development latest trends and trends

During the 4th China International Semiconductor Lighting Forum (CHINA SSL) hosted by the National Semiconductor Lighting Engineering R&D and Industry Alliance (CSA), after 140 papers, analysis of 54 speakers of the forum, and selection of 24 guests at home and abroad Key interviews (divided into four groups of interviews, interviews and outlines before the meeting), on-site questionnaires and interactive seminars of four chapters (especially the extension/chip branch, in the interactive discussion session of the conference, a questionnaire was specially designed. Through the interactive discussion between the 7 guests on the stage and the 45 present participants, the delegates boldly made predictions on the future development of the technology, as well as the research, induction and analysis of Chinese and foreign enterprise cooperation and competition dialogue, etc. The latest developments and trends in semiconductor lighting technology and industry development are summarized as follows:

(1) Technology update and development roadmap

1. The existing technical route (sapphire substrate) is unlikely to be replaced in the near future (3-5 years). According to this route, it is expected to achieve 130-150lm/W target in 2010, existing epitaxial materials and chips. Technology such as technology and technology will not have new breakthroughs in 3-5 years. Improving the lumens by simply improving the substrate material is not the biggest issue in the development of LEDs at this stage. The substrate stripping technique of sapphire and its associated vertical structure in the substrate material will still dominate for a long time.

2. At present, the biggest technical problem of LED is two high and low, that is, improving internal quantum efficiency and light extraction efficiency, reducing light decay (increasing life) and reducing cost. The final power efficiency of the LED is the product of electrical injection efficiency, internal quantum efficiency, light extraction efficiency, packaging efficiency, light conversion efficiency, and Stokes efficiency throughout the production process. The two indicators of internal quantum efficiency and light extraction efficiency need to be greatly improved. Light-effect Droop (attenuation of the photoelectric efficiency of LEDs under high current conditions) is a relatively large problem. Cost is the biggest obstacle to replacing traditional lighting with LEDs. In addition, the price of LEDs is not as high as that of traditional lamps. Although it can save the cost of replacement and maintenance for later use, the initial cost is often directly affected by the purchase budget. Localization of major equipment and raw materials is one of the important and effective ways to reduce costs. For example, in the cost of producing a 1W high-power LED, the cost of the chip accounts for 57%-87% of the total device (the raw material for epitaxy accounts for 37% of the chip cost, and the depreciation and power of MOCVD equipment accounts for 13% of the chip cost).

3, the current technology to solve the light efficiency preferred vertical structure and photonic crystal (3-5 years). Thin-film LLO-LEDs and low-cost Si substrate thin film growth technologies will continue to maintain their advantages in the short term. Laser-stripped large-size vertical structure LEDs are currently the best solution for achieving high-brightness, power-type white LEDs. Compared with the traditional process, not only the light extraction efficiency is high, the forward voltage drop is small, the far field radiation is good, and the light extraction efficiency does not decrease significantly with the increase of the die size, which is the first choice for improving the internal quantum efficiency. In the case of large-flow injection, the tendency of the photoelectric conversion efficiency of the vertical structure LED to decay is also much slower than the original process. Photonic crystals are the only way to improve the efficiency of external quantum.

4. Future technology trends are non-polar surface epitaxy (5-8 years) and GaN substrate epitaxy (8-10 years). The non-polar surface growth technology can effectively reduce the built-in polarization field, and provides a new choice for improving the internal quantum efficiency. It is expected to break through the current obstacle of the integration of the three primary color LEDs - the high power efficiency of the green LED. This makes it possible to achieve warm tones as well as white LED illumination with adjustable tones. GaN substrate growth technology can effectively reduce defects and control non-uniformity, which is an effective method to fundamentally improve internal quantum efficiency. Experts believe that the application of GaN substrate technology can effectively suppress the decay of photoelectric efficiency appearing under high current conditions. It is expected that it will take 8-10 years to make a breakthrough.

5. Packaging and application. There is no obvious gap between domestic packaging and foreign countries, and it is the most likely area to occupy the commanding heights through independent innovation. However, R&D investment is not enough, especially for reliability research, such as high-power eutectic packaging technology. Corresponding supporting materials such as glue and brackets, especially equipment, are imported. In the global industrial chain of semiconductor lighting, China has a good foundation in landscape lighting, display, LED lighting manufacturing, solar LED lighting and so on.

(II) Application development trend

1. Market driven mode. Stimulating and driving R&D by market applications will become the future development trend. Different technologies and different parameters are optimized for different application requirements, which will become an important way to combine LED technology and product application in the future. Special lighting such as traffic signals, landscapes, and automotive lighting is the most profitable area and will continue to grow over the next 10 years.

2. Large-size LCD backlights are one of the largest potential markets. Backlighting is China's last chance in flat panel display. The breakthrough and advancement of this technology involves a wide range of efforts, including the following four aspects: LCD panel design and manufacturing (even involving LCD basic theory and process research) LED chip manufacturing and packaging; LCD TV whole machine industry; LED video display core control technology and integrated circuit design technology. Joint research requires a technical leader, a bond that requires a benefit, and the need for the government to act according to market rules.

3. China's demand for LED products is huge. The 2008 Olympics is considered an important opportunity to showcase LED applications to the world. Promoting semiconductor lighting technology in the field of road lighting will effectively reduce electricity bills, reduce cable laying costs, reduce maintenance costs, and improve road travel safety. It will also help governments at all levels to complete energy conservation and emission reduction targets.

4, 5-10 years into the general lighting. When LEDs can fully enter general lighting, some think that 3 years, some think that 5 years, some think longer; however, experts agree that LEDs pose a greater threat to traditional lighting sooner or later. Experts believe that when comparing LEDs with conventional light sources, it is important to pay attention to the comparison of the efficiency of the entire luminaire system, rather than the comparison of the luminous efficacy of a single LED with the efficacy of a single other source. At present, the utilization efficiency of the LED lamp system has actually been 1.5-2 times higher than that of the energy-saving lamp. In addition, since the application design of the LED is plastic, it also determines that it has a larger application range.

(3) Industry trends

1. In 2007, the semiconductor lighting industry has entered a new era.


(1) Semiconductor lighting technology has been verified. The single-watt lumens exceeds one hundred, the single lumens cost is less than one cent, and the single-light lumens are only a matter of time. People finally form a consensus. From one year to two years, the green environmental protection and energy-saving semiconductor lighting source will surely Beyond any other light source, go to the broad general lighting market.

(2) Special lighting products have matured and three major features have emerged. At present, the application of semiconductor lighting, the main body of the new application is gradually extended to indoor and outdoor lighting, Philips, Osram, Cree, etc. have invested a lot of power in this field, and there are many targeted products launched. The characteristics of LED narrowband spectrum constitute the spectral free plasticity of LED illumination, the nature of LED close to point source and the small volume constitute the free plasticity of LED in space and the potential high luminous efficiency of LED. These three constitute the future application field of LED. Will be even broader.

(3) The market continues to expand, from display to lighting, from special lighting to general lighting. The outdoor lighting market such as road lighting and tunnel lighting will gradually start with the improvement of LED light efficiency and price, and new application fields such as agriculture, military and aviation will be gradually developed, and indoor lighting with greater market space will be developed. The embryonic form is also gradually forming.

2. China's status

(1) Domestic packaging and application enterprises rely on price advantage and rapid market adaptability, occupying the global low-end market. In the field of packaging and application, China is fully capable and capable of occupying a place in the high-end market, but it must increase product innovation, strengthen brand strategy and brand cultivation. In addition, packaging and applications, especially the production and processing of applied products, have a tendency to shift to China internationally.

(2) Domestic upstream enterprises are still in the stage of initial accumulation of efforts to upgrade technology and expand scale. They are still at a disadvantage except for possessing the market but not occupying the market. In the first half of 2007, Taiwanese companies with a monthly production scale of 200 KK-500 KK/month, such as Canyuan and Taigu, suffered losses, while Huashang only earned 30 million Taiwan dollars. The domestic GaN chip production capacity is only 500 KK / month. Obviously, the simple expansion of domestic upstream enterprises can not greatly enhance the comprehensive competitiveness of enterprises, especially investment benefits. How to survive and develop has become a problem worth pondering. Blind investment and wrong or outdated corporate planning will be eliminated in a new wave of industrial restructuring.

(3) The industrialization supporting capacity of equipment and key raw materials is scarce. With the expansion of the industry scale and structural changes, the impact of equipment on industrial development is also more obvious. For example, the price of the chip is mainly subject to the high purchase cost of the equipment. At the same time, high-priced equipment has also made domestic chip makers less profitable and unable to invest in large R&D funds. To a certain extent, this also increases the dependence of domestic semiconductor lighting on foreign chips.

3. LED is a global industry

(1) The important stage of global mergers and acquisitions and restructuring. Through the vertical connection, the international large companies quickly realize the integration of the upper, middle and lower reaches under the global unified marketing strategy through mergers and acquisitions, forming a superior competitive advantage. For example, Philips wholly owns Lumileds and acquires Color Kinetics. Taiwanese enterprises rely on strong scale manufacturing, industrial agglomeration and foundry advantages, through cross-integration, that is, through mutual reciprocal share reorganization, merger of similar enterprises, rapid formation of huge production scale and rapid market share. Such as the merger of the crystal and the League of Nations, United States, Yuan arsenic and Lian Yong.

(2) Chinese enterprises have begun to become the target and target of foreign cooperation. The global development of the semiconductor lighting industry is something that every company must face and cannot avoid. The development of the semiconductor lighting industry does not necessarily emphasize the complete independent research and development. It can fully utilize the global characteristics of the semiconductor lighting industry, introduce overseas advanced technologies into China through mergers and acquisitions or cooperation, and strive to compete with the international manufacturers at the same technical level. . If we choose overseas companies or capital to cooperate, we can introduce new technologies and good management, which can make our products and brands better go abroad, and it is also a good development path.

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