It is no exaggeration to say that becoming a machine intelligence researcher is really an exciting thing. Recently, a series of successes in machine learning (ML) and artificial intelligence (AI) – from the realization of human-machine equal speech recognition to the defeat of world champions, have shown the prospects for these areas. However, most of these successes are limited to the closed world of virtual worlds, and the operation of this "closed" world offers two significant advantages for AI agents. First of all, these AI agents only need to design operations for specific tasks - a smart agent playing a board game only needs to understand what the best strategy for the next step is, without the need for others. Second, most of the AI ​​programs in these systems enjoy a wealth of resources—by annotating, near-infinite training data collected. These “big data†can be obtained from the cumbersome past experience accumulation or through self-learning technology. So, let's consider robots , Internet of Things (IoT) devices, and autonomous vehicle devices that run and perform tasks in the real world, which is beyond the assumption of the narrow paradigm of closed paradigms. These devices not only have to fulfill their primary tasks, but must also live in an open world and accept the challenges of various unmodeled external phenomena. In addition, these systems need to be adapted and learned with minimal training. Open environments are especially challenging given the need for a large amount of technical training data to achieve successful examples, such as devices that use reinforcement learning, demonstration learning, and migration learning. Although there are already examples of integrated AI, artificial intelligence systems can be built with several separate components, but we still need to explore some basic principles so that the core architecture can build a adaptability and intelligence in the real world. system. A snapshot of AirSim shows the aircraft flying in an urban environment. The illustration shows the depth generated in real time, object segmentation and front camera stream. In Microsoft's research department, the field of robotics and network physics systems is on the agenda, with the goal of exploring and revealing unified algorithms and technical structures to achieve this real-world artificial intelligence. Microsoft's belief is to solve three key aspects at the basic level in order to achieve the next major leap in the establishment of AI agents in the real world. These three aspects are structure, simulation and security, as follows: structure Structure: One way to solve the problem of data scarcity is to use real-world statistical and logical structures. For example, the order in the environment (such as traffic rules, natural laws and our social circle) can be very helpful in eliminating the uncertainty in the real world. For example, our recent work on No-Regret Replanning Under Uncertainty shows how existing robotic path planning algorithms use the statistical structure of wind to determine how close to the most in case of insufficient data. Excellent path.
0.8mm Pin Header
Antenk 0.8mm Pitch Male Header series is a fine pitch, low profile, single/dual/three/four row, PCB mounted connector set intended for limited space applications or where total weight is a factor. Our specially tooled insulators and contacts maintain consistent high quality through our automated production processes. Each series is available in thru-hole PCB or SMT mounting and plated tin, gold or selective gold as specified.
0.8mm Pin Header Options
Number of Rows
0.8mm Pin Header Specifications:
Material: Standard Hi-Temp insulator: Nylon 6T, rated UL94V-0
Pin Header,0.8Mm Male Header,0.8Mm Pin Header,0.8Mm Male Header Pins,0.8mm Pitch Pin Header,SMT 0.8mm Pin Header, THT 0.8mm Pin Header ShenZhen Antenk Electronics Co,Ltd , https://www.pcbsocket.com
1/Single
2/Double
3/Three
4/Quad
Number of Positions
2 Position
3 Position
4 Position
5 Position
6 Position
8 Position
10 Position
12 Position
14 Position
15 Position
16 Position
17 Position
20 Position
Termination Style
SMD/SMT
Through Hole
Mounting Angle
Right Angle
Straight
Insulator Color: Black
Contacts: Phosphor Bronze
Plating:
U = Gold over nickel underplate
SG = Gold over nickel underplate on
contact area, tin over copper underplate on tails.
T = Tin over copper underplate overall.
Electrical:
Operating voltage: 250V AC max.
Current rating: 1 Amp max
Contact resistance: 20 mΩ max. initial
Insulation resistance: 5000 MΩ min.
Dielectric withstanding voltage: 1000V AC for 1 minute
Mechanical:
Mating durability: 500 cycles min.
Temperature Ratings: Operating temperature: -40°C to +105°C
Max process temp: 230°C for 30 ~ 60 seconds (260°C for 10 seconds)
Soldering process temperature: 260°C
Packaging:
Anti-ESD plastic bags or tubes
Approvals and Certifications:
UL Recognized File no. E224053