Several key factors in the selection and evaluation of high power regulators

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Overview:
Each generation of high-end processors, FPGAs, and ASICs adds a burden on the power supply due to heavier loads, but system designers rarely allocate additional system board space to accommodate this increased power. This squeeze on the power supply is exacerbated by the widespread need for more dedicated and power supplies mounted on the board to provide POL (point of load) adjustment to multiple voltage rails. Individual power rails must increasingly support currents from 10A to over 100A at low voltages (≤1V), requiring approximately 1% initial accuracy and excellent load transient deviation (less than a few percent). The challenge is therefore to find a power solution that is accurate and can provide large load currents at low voltages while taking up very little system board space.

When a suitable regulator solution is found, it must be evaluated for power loss and thermal resistance. If these two parameters do not meet the system's thermal requirements (especially when the system must operate under high ambient temperature conditions), it will result in a compromised original voltage regulator solution. Obviously, the conversion efficiency must be high to limit power loss, and the package design must have low internal thermal resistance and low ambient connection thermal resistance. As the solution shrinks, the thermal resistance area between the regulator and the board is also reduced, which makes it more difficult to keep the board low temperature, because the power regulator typically transfers most of the power loss to the system. In the board, the internal temperature of the system is significantly increased.

The real problem: heat and cooling cost systems and thermal design engineers spend a lot of time modeling and evaluating these complex electronic systems to design solutions that remove heat loss in the form of heat. Air flow and heat sinks are typically used to remove this unwanted heat. The real problem is that new processors, FPGAs, and custom ASICs typically consume significantly more power as the internal temperature of the system increases. Unfortunately, this requires a power regulator to provide more power and will increase internal power losses, further increasing the system temperature. Therefore, eliminating power loss and heat is very important, and high-density power solutions must limit power loss and effectively eliminate heat. However, an extremely compact power supply solution either dissipates too much power or does not effectively remove heat, so it cannot operate in a high temperature environment without substantial derating. A suitable solution is needed to help alleviate this practical problem.

Not surprisingly, in order to keep the temperature of high power designs at a reasonable level, it is important to note that the cooling method is critical. Installing fans, cooling plates, heat sinks, and sometimes immersing the system in special liquids are examples of ways that designers are forced to adopt. All of these methods are expensive but necessary. However, if a high-power point-of-load regulator can provide the required power while dissipating heat evenly and efficiently, the requirements for cooling this part of the circuit will be reduced, thereby reducing the size, weight, and maintenance of the cooling system. And cost.
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